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Company
TE Connectivity
Description
SO DIMM Sockets
Bill of material
2-2013310-1
Part Number
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Description
Alias
DRAM Type
Connector System
Profile
Row-to-Row Spacing
mm
Row-to-Row Spacing
in
Sealable
Connector & Contact Terminates To
Center Post
Product Type
Module Orientation
Number of Positions
Number of Rows
Keying
Number of Keys
Center Key
Number of Bays
DRAM Voltage
V
SGRAM Type
SGRAM Voltage
V
Ejector Type
Module Key Type
Latch Plating Material
Latch Material
Retention Post Location
Ejector Location
Retention Post Material
Contact Base Material
PCB Contact Termination Area Plating Material
Contact Underplating Material
Contact Mating Area Plating Material
Contact Mating Area Plating Thickness
µm
Contact Mating Area Plating Thickness
µin
Contact Current Rating (Max)
A
Socket Type
Socket Style
Insertion Style
PCB Mount Retention Type
PCB Mount Retention
PCB Mounting Style
Connector Mounting Type
Centerline (Pitch)
mm
Centerline (Pitch)
in
Housing Material
Housing Color
Stack Height
mm
Stack Height
in
Operating Temperature Range
°C
Operating Temperature Range
°F
Circuit Application
UL Flammability Rating
Packaging Method
Packaging Quantity
Comment
Embedded Preview + Generation
Preview
CAD Download
3D
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