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Company	TE Connectivity
Description	Mini DIMM Sockets
Bill of material	1-1735438-1
Part Number	1-1735438-1 1-1735438-1
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Description	MiniDIMM,R/A,1.8V,DDR2,RVS,15Au/AuFl MiniDIMM,R/A,1.8V,DDR2,RVS,15Au/AuFl
DRAM Type	Double Data Rate (DDR) 3
Connector System	Board-to-Board
Row-to-Row Spacing	8.7	mm
Row-to-Row Spacing	.343	in
Connector & Contact Terminates To	Printed Circuit Board
Profile	Standard
Product Type	Socket
Center Post	With
Number of Positions	244
Module Orientation	Right Angle
Number of Rows	2
Number of Hold-Downs	6
Keying	Standard
Number of Keys	1
Center Key	None
DRAM Voltage	1.5	V
Ejector Type	Standard
Hold-Down Material	Copper Alloy
Retention Post Location	None
Center Post Material	Liquid Crystal Polymer (LCP)
Latch Color	Natural
Module Key Type	Per JEDEC MO-244, Module Variation AB/BB/CB, Standard Orientation
Latch Material	Liquid Crystal Polymer (LCP)
Ejector Location	Both Ends
Ejector Material	Liquid Crystal Polymer (LCP)
Ejector Material Color	Natural
Contact Base Material	Copper Alloy
PCB Contact Termination Area Plating Material	Gold Flash
Contact Underplating Material	Nickel
Contact Current Rating (Max)	1	A
Socket Type	Memory Card
Contact Mating Area Plating Thickness	30	µin
Socket Style	Mini DIMM
Contact Mating Area Plating Material	Gold
Insertion Style	Direct Insert
PCB Mount Retention Type	Solder Peg
PCB Mount Retention	With
Locating Posts	With
PCB Mounting Style	Surface Mount
Connector Mounting Type	Board Mount
Centerline (Pitch)	.6	mm
Centerline (Pitch)	.024	in
Hold-Down Plating Material	Tin
Housing Color	Black
Housing Material	LCP (Liquid Crystal Polymer)
Height Above PC Board	9.79	mm
Height Above PC Board	.385	in
Center Retention Hole Diameter	2.5	mm
Center Retention Hole Diameter	.098	in
Operating Temperature Range	-55 – 125	°C
Operating Temperature Range	-67 – 257	°F
Circuit Application	Power & Signal
UL Flammability Rating	UL 94V-0
Packaging Quantity	15
Packaging Method	Hard Tray, Tray

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1-1735438-1