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可提供的產品目錄語言:
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English
4-5332070-4
TE Connectivity
Connectors
Card & Socket Connectors
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CAD模型選擇
{teconnectivity/connectors/card_and_socket_connectors/discrete_sockets.prj},{NB=4-5332070-4},{PN=4-5332070-4},{SHA256=kwccH8YerZyvFR2jUDn6aOrnw4IM+BxTlyJU9jciKCw=},{INAME=00102__c2d42d53320702d42da2d3d},{CTEPS=CLICK HERE to Contact TE Product Support},{FSCPBN=CLICK HERE to Find Specs, Compatible Parts, or Buy Now},{LINKCTEPS=http://www.te.com/usa-en/about-te/connected-world/customer-support.html?te_bu=Cor&te_type=disp&te_campaign=cdn_glo_cor-cdn-global-disp-prtnr-fy19-cdn-cust-supt-link_sma-300_7&elqCampaignId=35242 },{LINKFSCPBN=https://www.te.com/usa-en/product-4-5332070-4.html?te_bu=Cor&te_type=disp&te_campaign=cdn_glo_cor-cdn-global-disp-prtnr-fy19-cdn-buy-link_sma-300_3&elqCampaignId=35238},{DESC=SOCKET,MIN-SPR W/N SN-AU SER-4},{ALIAS=N/A},{SS=Open Bottom}
請根據技術需求選擇所需產品. 可選屬性在表格中高亮顯示. 選擇可以通過點擊表格或數值來重置.
HELP_VARIABLE
Company
TE Connectivity
Description
Discrete Sockets
Bill of material
4-5332070-4
Part Number
4-5332070-4
4-5332070-4
Contact TE Product Support
CLICK HERE to Contact TE Product Support
Find Specs, Compatible Parts, or Buy Now
CLICK HERE to Find Specs, Compatible Parts, or Buy Now
Description
SOCKET,MIN-SPR W/N SN-AU SER-4
SOCKET,MIN-SPR W/N SN-AU SER-4
Alias
N/A
N/A
Sleeve Style
Open Bottom
Open Bottom
Connector System
Cable-to-Board
Cable-to-Board
Sealable
No
No
Connector & Contact Terminates To
Printed Circuit Board
Printed Circuit Board
Product Type
Contact
Contact
Profile
Zero
Zero
Wire/Cable Type
Discrete Wire
Discrete Wire
Sealant
No
No
Sleeve Plating Material
Tin
Tin
Sleeve Material
Copper
Copper
Contact Base Material
Beryllium Copper
Beryllium Copper
Contact Current Rating (Max)
6.5
6.5
A
Contact Type
Socket
Socket
Contact Spring Plating Thickness
1.27
1.27
µm
Contact Spring Plating Thickness
30
30
µin
Contact Spring Plating Material
Gold
Gold
Contact Mating Area Plating Thickness
30
30
µm
Contact Mating Area Plating Thickness
30
30
µin
Contact Transmits (Typical)
Signal (Data)/Power
Signal (Data)/Power
Contact Mating Area Plating Material
N/A
N/A
Socket Type
Discrete
Discrete
Termination Method to Printed Circuit Board
Through Hole - Press-Fit
Through Hole - Press-Fit
Termination Method to Wire & Cable
Solder
Solder
Insertion Method
Hand/Semi-Automatic
Hand/Semi-Automatic
Socket Length
3.63
3.63
mm
Hole Size (Recommended)
.072
.072
in
Wire/Cable Size
.326 – .518
.326 – .518
mm2
Wire/Cable Size
22 – 20
22 – 20
AWG
Socket Length
.143
.143
in
Hole Size (Recommended)
1.83
1.83
mm
Mating Pin Diameter Range
.71 – .84
.71 – .84
mm
Mating Pin Diameter Range
.028 – .033
.028 – .033
in
PCB Thickness (Recommended)
.79 – 3.18
.79 – 3.18
mm
PCB Thickness (Recommended)
.031 – .125
.031 – .125
in
Operating Temperature Range
-65 – 125
-65 – 125
°C
Operating Temperature Range
-85 – 257
-85 – 257
°F
Circuit Application
Power & Signal
Power & Signal
Packaging Method
Bag, Loose Piece
Bag, Loose Piece
Packaging Quantity
2000
2000
Spring Material
Beryllium Copper
Beryllium Copper
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