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Company
TE Connectivity
Description
DIMM Sockets
Bill of material
5-2199154-8
Part Number
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Description
DRAM Type
Connector System
Row-to-Row Spacing
mm
Row-to-Row Spacing
in
Sealable
Connector & Contact Terminates To
Center Post
Profile
Product Type
Number of Positions
Module Orientation
°
Number of Bays
Number of Rows
Keying
Number of Keys
Center Key
DRAM Voltage
V
Ejector Type
Retention Post Location
Latch Color
Module Key Type
Latch Plating Material
Latch Material
Ejector Location
Ejector Material
Retention Post Material
Ejector Material Color
Contact Base Material
PCB Contact Termination Area Plating Material
Contact Underplating Material
Contact Current Rating (Max)
A
Socket Type
Socket Style
Solder Tail Contact Plating Thickness
µm
Solder Tail Contact Plating Thickness
µin
Contact Mating Area Plating Thickness
µm
Contact Mating Area Plating Thickness
µin
Contact Mating Area Plating Material
Insertion Style
Termination Post Length
mm
Termination Post Length
in
PCB Mount Retention Type
PCB Mount Retention
PCB Mounting Style
Connector Mounting Type
Polarization
Locating Posts
Mounting Angle
Boardlock Material
Centerline (Pitch)
mm
Centerline (Pitch)
in
Housing Color
Housing Material
Height Above PC Board
mm
Height Above PC Board
in
Center Retention Hole Diameter
mm
Center Retention Hole Diameter
in
Operating Temperature Range
°C
Operating Temperature Range
°F
Circuit Application
UL Flammability Rating
Packaging Method
Packaging Quantity
Embedded Preview + Generation
Preview
CAD Download
3D
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