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Company	TE Connectivity
Description	8-2199154-4
Bill of material	8-2199154-4
Part Number	8-2199154-4
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TE Internal #	8-2199154-4
TE Internal Description	DDR4 DIMM 288 Pin TH type
DRAM Type	Double Data Rate (DDR) 4
Connector System	Board-to-Board
Sealable	No
Connector & Contact Terminates To	Printed Circuit Board
Center Post	With
Product Type	Socket
Number of Positions	288
Module Orientation	Vertical
Number of Bays	2
Number of Rows	2
Keying	Standard
Number of Keys	1
Center Key	Offset Right
DRAM Voltage	1.2	V
Ejector Type	Standard
Retention Post Location	None
Latch Color	Black
Module Key Type	Offset Right
Latch Material	High Temperature Thermoplastic
Ejector Location	Both Ends
Ejector Material	High Temperature Thermoplastic
Retention Post Material	Stainless Steel
Ejector Material Color	Natural
Contact Base Material	Copper Alloy
PCB Contact Termination Area Plating Material	Tin
Contact Underplating Material	Nickel
Contact Current Rating Max	.75	A
Socket Type	Memory Card
Socket Style	DIMM
Solder Tail Contact Plating Thickness	3 um [ 118.1 uin ]
Contact Mating Area Plating Thickness	.76 um [ 30 uin ]
Contact Mating Area Plating Material	Gold
Insertion Style	Direct Insert
Termination Post Length	3.18 mm [ .125 in ]
PCB Mount Retention Type	Boardlock
PCB Mount Retention	With
PCB Mounting Style	Through Hole - Solder
Connector Mounting Type	Board Mount
Locating Posts	Without
Mounting Angle	Vertical
Boardlock Material	Stainless Steel
Centerline	.85 mm [ .0334 in ]	Pitch
Housing Color	Blue
Housing Material	High Temperature Nylon
Height Above PC Board	20 mm [ .787 in ]
Row-to-Row Spacing	2.2 mm [ .08 in ]
Center Retention Hole Diameter	1.2 mm [ .047 in ]
Operating Temperature Range	-55 - 105 C [ -67 - 221 F ]
Circuit Application	Signal
UL Flammability Rating	UL 94V-0
Packaging Method	Box & Tray, Tray
Packaging Quantity	80

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8-2199154-4