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Company	TE Connectivity
Description	6-330808-5
Bill of material	6-330808-5
Part Number	6-330808-5
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TE Internal #	6-330808-5
TE Internal Description	SOCKET,MIN-SPR SN-AU SER-1
Sleeve Style	Closed Bottom
Connector System	Cable-to-Board
Sealable	No
Connector & Contact Terminates To	Printed Circuit Board
Product Type	Contact
Profile	Zero
WireCable Type	Discrete Wire
Sleeve Plating Material	Tin
Sleeve Material	Copper
Contact Base Material	Beryllium Copper
Contact Current Rating Max	5	A
Contact Type	Socket
Contact Spring Plating Thickness	.762 um [ 30 uin ]
Contact Spring Plating Material	Gold
Contact Mating Area Plating Thickness	30 um [ 30 uin ]
Contact Transmits	Signal (Data)Power	Typical
Socket Type	Discrete
Termination Method to Printed Circuit Board	Through Hole - Press-Fit
Termination Method to Wire & Cable	Solder
Insertion Method	HandSemi-Automatic
Socket Length	3.61 mm [ .142 in ]
Hole Size	1.04 mm [ .041 in ]	Recommended
Wire Size	28 - 25	AWG
Wire Size	.081 - .162	mm2
Mating Pin Diameter Range	.33 - .51 mm [ .013 - .02 in ]
PCB Thickness	.79 - 3.18 mm [ .031 - .125 in ]	Recommended
Operating Temperature Range	-65 - 125 C [ -85 - 257 F ]
Solder Process Feature	None
Circuit Application	Power & Signal
Packaging Method	Bag, Loose Piece
Packaging Quantity	2000
Spring Material	Beryllium Copper

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