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Company	TE Connectivity
Description	2-2013022-3
Bill of material	2-2013022-3
Part Number	2-2013022-3
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TE Internal #	2-2013022-3
TE Internal Description	EMBOSS TAPE DDR3 204P 4H STD Au 0.76
DRAM Type	Double Data Rate (DDR) 3
Connector System	Cable-to-Board
Sealable	No
Connector & Contact Terminates To	Printed Circuit Board
Product Type	Socket
Module Orientation	Right Angle
Number of Positions	204
Number of Rows	2
Keying	Standard
Number of Keys	1
Center Key	Offset Left
Number of Bays	2
DRAM Voltage	1.5	V
SGRAM Voltage	1.5	V
Ejector Type	Locking
Connector Profile	Standard
Module Key Type	SGRAM
Latch Plating Material	Tin
Latch Material	Stainless Steel
Ejector Location	Both Ends
Contact Base Material	Copper Alloy
PCB Contact Termination Area Plating Material	Gold Flash
Contact Mating Area Plating Material	Gold
Contact Mating Area Plating Material Thickness	.76 um [ 30 uin ]
Contact Current Rating Max	.5	A
Socket Type	Memory Card
Socket Style	SO DIMM
Insertion Style	Cam-In
PCB Mount Retention Type	Solder Tail
PCB Mount Retention	With
PCB Mounting Style	Surface Mount
Connector Mounting Type	Board Mount
Centerline	.6 mm [ .024 in ]	Pitch
Housing Material	High Temperature Thermoplastic
Housing Color	Black
Stack Height	4 mm [ .157 in ]
Row-to-Row Spacing	8.2 mm [ .322 in ]
Operating Temperature Range	-55 - 85 C [ -67 - 185 F ]
Circuit Application	Power
UL Flammability Rating	UL 94V-0
Packaging Method	Emboss on Reel
Packaging Quantity	200
Comment	Without floating peg.

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2-2013022-3